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  march 2007 rev 1 1/10 STTH30R04 ultrafast recovery diode main product characteristics features and benefits ultrafast switching low reverse current low thermal resistance reduces switching and conduction losses high junction temperature insulated package: dop3i ? electrical insulation = 2500 v rms package capacitance = 12 pf description the compromise-free, high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. these characteristics make it ideal for heavy duty applications that demand long term reliability. note: d 2 pak - 2 anode terminals must be shorted on board. order codes i f(av) 30 a v rrm 400 v t j 175 c v f (typ) 0.97 v t rr 24 ns part number marking STTH30R04d STTH30R04d STTH30R04g STTH30R04g STTH30R04g-tr STTH30R04g STTH30R04w STTH30R04w STTH30R04pi STTH30R04pi k a k a k a a k a k a k aa to-220ac STTH30R04d do-247 STTH30R04w d 2 pak STTH30R04g dop3i STTH30R04pi table 1. absolute ratings (limiting values at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 400 v i f(rms) rms forward current 50 a i f(av) average forward current, = 0.5 to-220ac / do-247 / d 2 pa k t c = 120 c 30 a dop3i t c = 90 c i frm repetitive peak forward current t p = 10 s, f = 1 khz 500 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 300 a t stg storage temperature range -65 to +175 c t j maximum operating junction temperature range -40 to +175 c www.st.com
characteristics STTH30R04 2/10 1 characteristics to evaluate the conduction losses use the following equation: p = 0.9 x i f(av) + 0.01 x i f 2 (rms) table 2. thermal parameters symbol parameter value unit r th(j-c) junction to case to-220ac / do-247 / d 2 pa k 1 . 1 5 c/w dop3i 1.9 table 3. static electrical characteristics symbol parameter test conditions min typ max unit i r (1) 1. pulse test: t p = 5 ms, < 2 % reverse leakage current t j = 25 c v r = v rrm 15 a t j = 100 c 3 30 t j = 125 c 15 150 v f (2) 2. pulse test: t p = 380 s, < 2 % forward voltage drop t j = 25 c i f = 15 a 1.26 v t j = 150 c 0.8 1.0 t j = 25 c i f = 30 a 1.45 t j = 100 c 1.3 t j = 150 c 0.97 1.2 table 4. dynamic characteristics symbol parameter test conditions min typ max unit t rr reverse recovery time i f = 1 a, di f /dt = -200 a/s, v r = 30 v, t j = 25 c 24 35 ns i f = 1 a, di f /dt = -15 a/s, v r = 30 v, t j = 25 c 78 100 i f = 1 a, i r = 1 a, i rr = 0.25 a, t j = 25 c 50 i rm reverse recovery current i f = 30 a, di f /dt = -200 a/s, v r = 160 v, t j = 125 c 10 14 a t fr forward recovery time i f = 30 a di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 500 ns v fp forward recovery voltage i f = 30 a di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 2.9 v
STTH30R04 characteristics 3/10 figure 1. conduction losses versus average current figure 2. forward voltage drop versus forward current 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 p(w) =0 05 =0 1 =0 2 =0 5 =1 t =tp/t tp i f(av) (a) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 i fm (a) t j =150c (maximum values) t j =150c (maximum values) t j =150c (typical values) t j =150c (typical values) t j =25c (maximum values) t j =25c (maximum values) v fm (v) figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. peak reverse recovery current versus di f /dt (typical values) 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 zth (j c) /rth (j c) single pulse to-220ac d2pak do-247 dop-3i tp(s) 0 2 4 6 8 10 12 14 16 18 20 22 10 100 1000 i rm (a) i f = 30 a v r =320 v t j =125 c t j =25 c di f /dt(a/s) figure 5. reverse recovery time versus di f /dt (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) 0 20 40 60 80 100 120 140 160 180 10 100 1000 t rr (ns) i f = 30 a v r =320 v t j =125 c t j =25 c di f /dt(a/s) 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 10 100 1000 q rr (nc) i f = 30 a v r =320 v t j =125 c t j =25 c di f /dt(a/s)
characteristics STTH30R04 4/10 figure 7. thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board fr4, e cu = 35 m) figure 8. relative variations of dynamic parameters versus junction temperature 0 10 20 30 40 50 60 70 80 0 2 4 6 8 10 12 14 16 18 20 rth (j a) (c/w) d2pak s cu (cm2) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 i rm q rr i f = 30 a v r =320 v t j (c) q [t ]/q [t = 125 c] and i rr j rr j rm j rm j [t ]/i [t = 125 c] figure 9. transient peak forward voltage versus di f /dt (typical values) figure 10. forward recovery time versus di f /dt (typical values) figure 11. junction capacitance versus reverse voltage applied (typical values) 0 1 1 2 2 3 3 4 4 5 5 0 50 100 150 200 250 300 350 400 450 500 v fp (v) i f =30 a t j =125 c di f /dt(a/s) 0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 100 200 300 400 500 t fr (ns) i f =30 a v fr =1.1 x v f max. t j =125c di f /dt(a/s) 10 100 1000 1 10 100 1000 c (pf) f=1mhz v osc =30mv rms t j =25c v r (v)
STTH30R04 package information 5/10 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.8 nm (to-220fpac) / 0.55 nm (to-220ac, dop3i) maximum torque value: 1.0 nm (to-220fpac) / 0.70 nm (to-220ac, dop31) figure 12. d 2 pak footprint (dimensions in mm) table 5. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2m m a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
package information STTH30R04 6/10 table 6. do-247 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143 v h l5 l l3 v2 g f f3 l1 f2 l2 l4 v dia a d me
STTH30R04 package information 7/10 table 7. to-220ac dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151 a c d l7 ? i l5 l6 l9 l4 f h2 g l2 f1 e m
package information STTH30R04 8/10 in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 8. dop3i dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 b 1.20 1.40 0.047 0.055 c 1.45 1.55 0.057 0.061 c1 0.50 0.70 0.020 0.028 d 12.15 13.10 0.474 0.516 e 15.10 15.50 0.594 0.610 e1 7.55 7.75 0.297 0.305 e 10.80 11.30 0.425 0.445 g 20.4 21.10 0.815 0.831 l 14.35 15.60 0.565 0.614 p 4.08 4.17 0.161 0.164 q 2.70 2.90 0.106 0.114 r 4.60 typ. 0.181 typ. y 15.80 16.50 0.622 0.650 r e e1 g y d q c1 c a l e b ?p
STTH30R04 ordering information 9/10 3 ordering information 4 revision history part number marking package weight base qty delivery mode STTH30R04d STTH30R04d to-220ac 1.86 g 50 tube STTH30R04g STTH30R04g d 2 pak 1.48 g 50 tube STTH30R04g-tr STTH30R04g d 2 pak 1.48 g 1000 tape and reel STTH30R04w STTH30R04w do-247 4.40 g 30 tube STTH30R04pi STTH30R04pi dop3i 4.46 g 30 tube date revision description of changes 31-mar-2007 1 first issue.
STTH30R04 10/10 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. if any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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